Title :
Shear Ram Speed Analysis for Gold Wire Bond Shear Test
Author :
Sauli, Zaliman ; Retnasamy, Vithyacharan ; Ehkan, P. ; Nadzri, N.S.
Author_Institution :
Sch. of Microelectron. Eng., Univ. Malaysia Perlis (UniMAP), Arau, Malaysia
Abstract :
Wire bonding are utilized as 1st level interconnection in all electronic devices. The reliability of the bonded wires are assessed by wire bond shear test. In this paper the evaluation of the stress and strain response of the gold ball bond during wire bond shear test using finite element analysis is presented. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the gold ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test.
Keywords :
finite element analysis; gold; lead bonding; materials testing; stress-strain relations; 1st level interconnection; 3D nonlinear finite element model; Au; equivalent strain response; gold ball bond; gold wire bond shear test; reliability; shear ram speed analysis; stress and strain response; von mises stress; Analytical models; Finite element analysis; Gold; Random access memory; Strain; Stress; Wires; Ansys; Shear Test; Wirebond;
Conference_Titel :
Modelling Symposium (AMS), 2013 7th Asia
Conference_Location :
Hong Kong
DOI :
10.1109/AMS.2013.18
