• DocumentCode
    646726
  • Title

    A survey of narrowband IEMI global threats

  • Author

    Prasad, Santasriya ; Schamiloglu, Edl

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of New Mexico, Albuquerque, NM, USA
  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    397
  • Lastpage
    400
  • Abstract
    Intentional EMI (IEMI) or high power microwave (HPM) sources have been studied for over 40 years. Originally researchers in the United States and the former Soviet Union dominated the field. Today dozens of countries are actively pursuing programs in developing such sources. Early developments in the field were motivated by researchers pursuing sources with ever-greater output power levels and longer pulse durations (greater energy). The phenomenon of pulse shortening was recognized in the mid 1990´s as a fundamental barrier to this power derby and researchers regrouped to pursue other advances. Virtual prototyping using sophisticated particle-in-cell (PIC) codes was recognized as a critical tool at this time as well for source researchers. Novel advances are now routinely motivated by virtual prototyping. The global field in HPM source research in the last couple of years has been dominated by multispectral sources and phase coherent sources. This presentation will survey recent global advances in narrowband HPM source research.
  • Keywords
    electromagnetic interference; virtual prototyping; HPM sources; global field; high power microwave source; intentional EMI; narrowband IEMI global threats; output power levels; phase coherent sources; pulse durations; pulse shortening phenomenon; sophisticated particle-in-cell codes; virtual prototyping; Educational institutions; Laboratories; Magnetrons; Narrowband; Oscillators; Plasmas; Virtual prototyping;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670445
  • Filename
    6670445