High speed single-ended bus: Full-wave modeling methodology and correlation

Passive channels pose significant challenges to the serial link transmission for single-ended buses running at very high speed. This paper will cover different aspects of the challenges in modeling chips, packages, PCB´s, connectors and their interactions. The goal of the paper is to show full 3D link as well as hybrid 2D/3D link correlation for both passive (TDR/VNA) and active (system margins) measurements for a high speed memory bus. Full wave electromagnetic (EM) modeling is utilized to take into account important phenomena such as surface roughness and dispersive material behavior. The impact on system-level performance is analyzed by comparing results with and without crosstalk from adjacent lanes.