• DocumentCode
    646811
  • Title

    Study of BGA package cap for high-performance computing GPU

  • Author

    Wenjie Mao ; Yaping Zhou ; Naik, Anima ; Sudhakaran, Sunil

  • fYear
    2013
  • fDate
    5-9 Aug. 2013
  • Firstpage
    858
  • Lastpage
    862
  • Abstract
    GPU for high performance computing shows high current consumption and fast current variation which presents a big design challenge for power delivery. In this paper, power delivery design for a computing GPU is discussed focusing on package capacitors. Current behaviour of a computing application is illustrated first. The related power delivery challenge is presented with simulation and measurement. Next package capacitors are proposed to reduce noise and studied via simulation according to their placement, value, number, and type. Simulation data shows land side cap placed between IO rails and core VDD balls can effectively reduce power delivery noise without compromising BGA density. Measurement data correlates well with simulated power noise. There is about a 55mv noise improvement which yields a gain of 150MHz in GPU operational frequency.
  • Keywords
    ball grid arrays; graphics processing units; BGA package cap; IO rails; ball grid arrays; frequency 150 MHz; graphics processing units; high-performance computing GPU; land side cap; power delivery noise; power noise; via simulation; Capacitors; Computational modeling; Current measurement; Graphics processing units; Impedance; Noise; Noise measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
  • Conference_Location
    Denver, CO
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4799-0408-2
  • Type

    conf

  • DOI
    10.1109/ISEMC.2013.6670530
  • Filename
    6670530