DocumentCode
646811
Title
Study of BGA package cap for high-performance computing GPU
Author
Wenjie Mao ; Yaping Zhou ; Naik, Anima ; Sudhakaran, Sunil
fYear
2013
fDate
5-9 Aug. 2013
Firstpage
858
Lastpage
862
Abstract
GPU for high performance computing shows high current consumption and fast current variation which presents a big design challenge for power delivery. In this paper, power delivery design for a computing GPU is discussed focusing on package capacitors. Current behaviour of a computing application is illustrated first. The related power delivery challenge is presented with simulation and measurement. Next package capacitors are proposed to reduce noise and studied via simulation according to their placement, value, number, and type. Simulation data shows land side cap placed between IO rails and core VDD balls can effectively reduce power delivery noise without compromising BGA density. Measurement data correlates well with simulated power noise. There is about a 55mv noise improvement which yields a gain of 150MHz in GPU operational frequency.
Keywords
ball grid arrays; graphics processing units; BGA package cap; IO rails; ball grid arrays; frequency 150 MHz; graphics processing units; high-performance computing GPU; land side cap; power delivery noise; power noise; via simulation; Capacitors; Computational modeling; Current measurement; Graphics processing units; Impedance; Noise; Noise measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2013 IEEE International Symposium on
Conference_Location
Denver, CO
ISSN
2158-110X
Print_ISBN
978-1-4799-0408-2
Type
conf
DOI
10.1109/ISEMC.2013.6670530
Filename
6670530
Link To Document