DocumentCode :
64792
Title :
Improving Self-Heating Effect and Maximum Power Density in SOI MESFETs by Using the Hole’s Well Under Channel
Author :
Ramezani, Zahra ; Orouji, Ali Asghar
Author_Institution :
Dept. of Electr. & Comput. Eng., Semnan Univ., Semnan, Iran
Volume :
61
Issue :
10
fYear :
2014
fDate :
Oct. 2014
Firstpage :
3570
Lastpage :
3573
Abstract :
In this brief, we present a new silicon-on-insulator MESFET by using an SiGe region as a well for absorbing the holes which are generated in result of the impact ionization mechanism. The key idea in this brief is to improve the breakdown voltage and self-heating effect (SHE) by utilizing an SiGe region to decreasing the crowding of holes around the source. The well is located in the buried oxide under the channel region. Simulation results show two extra peaks created on the electric field distribution that improves the breakdown voltage. Also, the floating body effect improves due to absorbing the holes by the hole´s well and the lattice temperature decreases, so the SHE improves, too.
Keywords :
Ge-Si alloys; Schottky gate field effect transistors; impact ionisation; semiconductor device breakdown; silicon-on-insulator; SOI MESFET; SiGe; breakdown voltage; buried oxide; electric field distribution; floating body effect; hole well; impact ionization mechanism; lattice temperature; maximum power density; self-heating effect; silicon-on-insulator; Analytical models; Impact ionization; Logic gates; MESFETs; Silicon; Silicon germanium; Silicon-on-insulator; Breakdown voltage; MESFET; SiGe; self-heating effect (SHE); silicon-on-insulator (SOI);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2014.2352317
Filename :
6895283
Link To Document :
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