• DocumentCode
    64792
  • Title

    Improving Self-Heating Effect and Maximum Power Density in SOI MESFETs by Using the Hole’s Well Under Channel

  • Author

    Ramezani, Zahra ; Orouji, Ali Asghar

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Semnan Univ., Semnan, Iran
  • Volume
    61
  • Issue
    10
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    3570
  • Lastpage
    3573
  • Abstract
    In this brief, we present a new silicon-on-insulator MESFET by using an SiGe region as a well for absorbing the holes which are generated in result of the impact ionization mechanism. The key idea in this brief is to improve the breakdown voltage and self-heating effect (SHE) by utilizing an SiGe region to decreasing the crowding of holes around the source. The well is located in the buried oxide under the channel region. Simulation results show two extra peaks created on the electric field distribution that improves the breakdown voltage. Also, the floating body effect improves due to absorbing the holes by the hole´s well and the lattice temperature decreases, so the SHE improves, too.
  • Keywords
    Ge-Si alloys; Schottky gate field effect transistors; impact ionisation; semiconductor device breakdown; silicon-on-insulator; SOI MESFET; SiGe; breakdown voltage; buried oxide; electric field distribution; floating body effect; hole well; impact ionization mechanism; lattice temperature; maximum power density; self-heating effect; silicon-on-insulator; Analytical models; Impact ionization; Logic gates; MESFETs; Silicon; Silicon germanium; Silicon-on-insulator; Breakdown voltage; MESFET; SiGe; self-heating effect (SHE); silicon-on-insulator (SOI);
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2014.2352317
  • Filename
    6895283