Title :
Logi-thermal analysis of digital circuits using mixed-signal simulator Questa ADMS
Author :
Petrosyants, K.O. ; Rjabov, N.I.
Author_Institution :
Moscow State Inst. of Electron. & Math. (Tech. Univ.), Moscow, Russia
Abstract :
CAD sybsystem for logi-thermal analysis of the digital circuits is presented. Logical circuits are described by VHDL language. Thermal regimes are calculated by electro-thermal analogy method. For the calculation of the thermal resistances and capacitances the thermal 3D simulator Overheat-IC based on semi-analytical solution of three-dimensional heat conduction equation is used. For simultaneous calculation of logical and thermal characteristics of IC analog and mixed-signal simulator Questa ADMS is used.
Keywords :
CAD; electronic engineering computing; hardware description languages; logic circuits; CAD sybsystem; IC analog simulator Questa ADMS; VHDL language; digital circuits; electro-thermal analogy method; logi-thermal analysis; logical circuits; mixed-signal simulator Questa ADMS; overheat-IC; semianalytical solution; thermal 3D simulator; thermal capacitances; thermal resistances; three-dimensional heat conduction equation;
Conference_Titel :
Design & Test Symposium, 2013 East-West
Conference_Location :
Rostov-on-Don
Print_ISBN :
978-1-4799-2095-2
DOI :
10.1109/EWDTS.2013.6673151
