Title :
Compact electro-thermal models of interconnects
Author_Institution :
Dipt. di Elettron., Inf. e Bioingegneria, Politec. di Milano, Milan, Italy
Abstract :
In this paper a novel approach is proposed for generating nonlinear compact models of the dynamic electrothermal problems modeling interconnects. The method is very efficient and leads to accurate approximations of the space-time distribution of voltages, currents and temperature rises within the interconnects for all waveforms of the port variables.
Keywords :
integrated circuit interconnections; transmission lines; compact electro-thermal models; currents; dynamic electro-thermal problems; interconnects; nonlinear compact models; port variables; space-time distribution; temperature; voltages;
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
Conference_Location :
Berlin
Print_ISBN :
978-1-4799-2271-0
DOI :
10.1109/THERMINIC.2013.6675184