DocumentCode :
649494
Title :
[Front cover]
fYear :
2013
fDate :
25-27 Sept. 2013
Abstract :
Presents the front cover of this proceedings volume.
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
Conference_Location :
Berlin, Germany
Print_ISBN :
978-1-4799-2271-0
Type :
conf
DOI :
10.1109/THERMINIC.2013.6675187
Filename :
6675187
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=649494
