Integrating advanced interconnect technologies in a high power lighting application: First steps

This paper reports on first results towards the development of a high power lighting demonstrator of the FP7 Nanotherm project. The demonstrator aims to show an optimized ROHS compliant interconnect solution. Hereto sintered materials are considered as alternative interconnect materials. Additionally, a heat spreader concept is evaluated as alternative for state-of-the-art IMS boards. This paper shows preliminary results for: - Transient thermal measurements of the reference system. - First trials of sintered past and adhesive used to mount LEDs on DCB substrates. - Thermal finite element simulations of the heatspreader concept compared to the IMS solution.