• DocumentCode
    649527
  • Title

    Novel approach to compact modeling for nonlinear thermal conduction problems

  • Author

    Codecasa, L.

  • Author_Institution
    Dipt. di Elettron., Inf. e Bioingegneria, Politec. di Milano, Milan, Italy
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    164
  • Lastpage
    169
  • Abstract
    In this paper a novel approach is proposed for generating dynamic compact models of nonlinear heat diffusion problems for electronics components. The method is very efficient and leads to accurate approximations of the space-time distribution of temperature rise within the component for all waveforms of the injected powers.
  • Keywords
    electronics packaging; thermal diffusion; dynamic compact model; electronics component; nonlinear heat diffusion problem; nonlinear thermal conduction problem; space-time distribution; temperature rise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4799-2271-0
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2013.6675220
  • Filename
    6675220
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=649527