• DocumentCode
    649550
  • Title

    Thermal conductivity reduction in Si free-standing membranes investigated using Raman thermometry

  • Author

    Reparaz, J.S. ; Chavez-Angel, E. ; Gomis-Bresco, J. ; Wagner, M.R. ; Shchepetov, A. ; Prunnila, Mika ; Ahopelto, Jouni ; Alzina, F. ; Sotomayor Torres, C.M.

  • Author_Institution
    Inst. Catala de Nanociencia i Nanotecnologia, Bellaterra, Spain
  • fYear
    2013
  • fDate
    25-27 Sept. 2013
  • Firstpage
    95
  • Lastpage
    96
  • Abstract
    We report on the reduction of the thermal conductivity in ultra-thin suspended Si membranes with high crystalline quality at room temperature. A series of membranes with thicknesses ranging from 9 nm to 1.5 μm was investigated using Raman thermometry, a novel contactless optical technique for thermal conductivity determination. The temperature rise of a laser spot focused on the membranes was monitored as a function of the absorbed power. For this purpose, the absorption coefficient of the membranes was experimentally determined and also theoretically modelled. A systematic decrease in the thermal conductivity was observed as reducing the thickness of the membranes which is explained using the Fuchs-Sondheimer model through the influence of phonon boundary scattering at the surfaces of the membranes. The thermal conductivity of the thinnest membrane with d= 9 nm resulted in (9±2)W/mK, thus approaching the amorphous limit but still maintaining a high crystalline quality.
  • Keywords
    absorption coefficients; elemental semiconductors; membranes; phonons; silicon; thermal conductivity; Fuchs-Sondheimer model; Raman thermometry; Si; Si free-standing membranes; absorption coefficient; amorphous membrane; phonon boundary scattering; size 9 nm to 1.5 mum; technique; temperature 293 K to 298 K; thermal conductivity; ultra-thin suspended membranes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems (THERMINIC), 2013 19th International Workshop on
  • Conference_Location
    Berlin
  • Print_ISBN
    978-1-4799-2271-0
  • Type

    conf

  • DOI
    10.1109/THERMINIC.2013.6675244
  • Filename
    6675244