Transient cooling of power electronic devices using thermoelectric coolers coupled with phase change materials

This paper deals with the system design for integrating Si and SiC power dies along with thermo-electric coolers and phase change materials in order to thermally manage transient overloads occurring during operation for motor drive application. Different double-sided cooling designs are evaluated to take the best of each active stage. Multi-physic simulations are used to predict thermal performance and define the final architecture for such application taking into account final user specifications and sizing. This paper is a part of a series of planned publications on the ongoing work in the SMARTPOWER project.