• DocumentCode
    652449
  • Title

    Optimization of the Integration of Semiconductors in Vehicles

  • Author

    Reimer, Michael ; Birner, Ingo ; Wahl, Michael ; Brueck, Rainer

  • Author_Institution
    Res. & Innovation Center, BMW AG, Munich, Germany
  • fYear
    2013
  • fDate
    23-25 Oct. 2013
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Current vehicles in the automotive industry are increasingly equipped with a variety of complex electrical and electronic (abbr.: e/e) applications. These e/e applications are used to create innovative vehicle functions. One of the challenges in the development of e/e applications is the selection and integration of available semiconductor technologies and semiconductor products. Often only a semiconductor product with the latest technology enables an efficient and economical realization of innovative vehicle functions. The differing technology cycles and development processes between the semiconductor and automotive industries make it a challenge for the companies involved in the development. This paper describes an evaluation method to determine the integration potential of semiconductor components in vehicles. The method describes an interdisciplinary approach to prepare decisions for the integration of available semiconductor technologies and products in vehicles. The focus is on the use of the latest semiconductor technologies in the automotive industry.
  • Keywords
    automotive electronics; semiconductor technology; vehicles; automotive industry; complex electrical applications; electronic applications; innovative vehicle functions; integration potential; semiconductor products; semiconductor technologies; vehicles; Automotive engineering; Complexity theory; Electronics industry; Semiconductor device modeling; Technological innovation; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electric Vehicle Conference (IEVC), 2013 IEEE International
  • Conference_Location
    Santa Clara, CA
  • Type

    conf

  • DOI
    10.1109/IEVC.2013.6681151
  • Filename
    6681151