DocumentCode :
652953
Title :
Learning-based approximation of interconnect delay and slew in signoff timing tools
Author :
Kahng, Andrew ; Seokhyeong Kang ; Hyein Lee ; Nath, Siddhartha ; Wadhwani, Jyoti
Author_Institution :
CSE Depts., Univ. of California at San Diego, La Jolla, CA, USA
fYear :
2013
fDate :
2-2 June 2013
Firstpage :
1
Lastpage :
8
Abstract :
Incremental static timing analysis (iSTA) is the backbone of iterative sizing and Vt-swapping heuristics for post-layout timing recovery and leakage power reduction. Performing such analysis through available interfaces of a signoff STA tool brings efficiency and functionality limitations. Thus, an internal iSTA tool must be built that matches the signoff STA tool. A key challenge is the matching of “black-box” modeling of interconnect effects in the signoff tool, so as to match wire slew, wire delay, gate slew and gate delay on each arc of the timing graph. Previous moment-based analytical models for gate and wire slew and delay typically have large errors when compared to values from signoff STA tools. To mitigate the accumulation of these errors and preserve timing correlation, sizing tools must invoke the signoff STA tool frequently, thus incurring large runtime costs. In this work, we pursue a learning-based approach to fit analytical models of wire slew and delay to estimates from a signoff STA tool. These models can improve the accuracy of delay and slew estimations, such that the number of invocations of the signoff STA tool during sizing optimizations is significantly reduced.
Keywords :
interconnections; learning (artificial intelligence); optimisation; timing; wires; Vt-swapping heuristics; black-box modeling; incremental static timing analysis; interconnect delay; iterative sizing; leakage power reduction; learning-based approximation; post-layout timing recovery; signoff timing tools; slew; Analytical models; Computational modeling; Correlation; Delays; Logic gates; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
System Level Interconnect Prediction (SLIP), 2013 ACM/IEEE International Workshop on
Conference_Location :
Austin, TX
Type :
conf
DOI :
10.1109/SLIP.2013.6681682
Filename :
6681682
Link To Document :
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