Title :
SPICE Modeling of Piezoelectric Energy Harvesting Device Utilizing Stress Influence
Author :
Sonoda, Ken´ichiro ; Fujita, Takashi ; Kanda, K. ; Maenaka, Kazusuke ; Katsumura, Hidenori ; Tamura, Masato ; Kagata, Hiroshi
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of Hyogo, Himeji, Japan
Abstract :
This paper presents a SPICE modeling of piezoelectric energy harvesting (PEH) device. We developed a wireless sensor system with the PEH device as an application. The PEH device is composed of a stainless cantilever, which has a piezoelectric film on the both side surface. The PEH device oscillates at resonance frequency when the tip of the cantilever is plucked. In SPICE simulator, an equation of motion of the cantilever is described to express a mass-spring-damper system by behavioral source. The stress of the piezoelectric film is computed by theoretical calculation and FEM analysis. Then, the stress, the piezoelectric coefficient d31, and the area of the film surface formulate the electrical charge. The output voltage is given by the charge varying and an inherent capacitance. The comparison between an analysis and an experiment is represented. The output power of theoretical calculation and measurement are 310 μJ and 920 μJ respectively has occurred by plucking once. We also developed a prototype system of WSN node utilizing the PEH device. The system transmits the temperature data a few times by plucking once.
Keywords :
SPICE; cantilevers; energy harvesting; finite element analysis; piezoelectric devices; wireless sensor networks; FEM analysis; SPICE modeling; electrical charge; piezoelectric coefficient; piezoelectric energy harvesting device; piezoelectric film; stainless cantilever; stress influence; wireless sensor system; Energy harvesting; Mathematical model; Piezoelectric films; SPICE; Stress; Wireless sensor networks; SPICE; modeling; piezoelectric energy harvester; wireless sensor network;
Conference_Titel :
Green Computing and Communications (GreenCom), 2013 IEEE and Internet of Things (iThings/CPSCom), IEEE International Conference on and IEEE Cyber, Physical and Social Computing
Conference_Location :
Beijing
DOI :
10.1109/GreenCom-iThings-CPSCom.2013.302