• DocumentCode
    65393
  • Title

    Fabrication of Microstructures in LTCC Technology Using Selective Laser Ablation

  • Author

    Shafique, Muhammad Farhan ; Steenson, David Paul ; Robertson, Ian D.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. of Leeds, Leeds, AL, USA
  • Volume
    5
  • Issue
    6
  • fYear
    2015
  • fDate
    Jun-15
  • Firstpage
    845
  • Lastpage
    851
  • Abstract
    This paper presents a technique and initial conditions for the laser ablation of microstructures in a low temperature co-fired ceramic (LTCC) technology. It is demonstrated that 2.5-D microstructures can be realized cost effectively and precisely by deploying the proposed technique in which an infrared laser is used to carefully ablate portions of unfired LTCC green tape. A demonstration prototype consisting of three gears and their mounting platform is realized along with a detailed description of the attendant micromachining process. The ablated surface is examined using a scanning electron microscope and a surface profiler. The optimization of the laser parameters required to equalize the surface roughness of the ablated material to that of an unmachined LTCC substrate is also described.
  • Keywords
    ceramics; crystal microstructure; gears; laser ablation; micromachining; scanning electron microscopy; surface roughness; LTCC green tape; LTCC technology; infrared laser; laser parameters; low temperature co-fired ceramic technology; micromachining; microstructures; scanning electron microscopy; selective laser ablation; surface profiler; surface roughness; unmachined LTCC substrate; Laser ablation; Laser beam cutting; Machining; Rough surfaces; Substrates; Surface roughness; Surface treatment; Ceramic microelectromechanical systems (MEMS); laser machining; low temperature co-fired ceramic (LTCC); sensors and actuators; thick-film technology; thick-film technology.;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2015.2426720
  • Filename
    7108006