DocumentCode :
654719
Title :
Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications
Author :
Cohen, Emmanuel ; Ruberto, Mark ; Cohen, Moshik ; Pan, Helen K. ; Ravid, Shmuel
Author_Institution :
Mobile Wireless Group, Intel Haifa, Haifa, Israel
fYear :
2013
fDate :
21-23 Oct. 2013
Firstpage :
1
Lastpage :
5
Abstract :
An integrated CMOS 60GHz phased array antenna module supporting symmetrical 32 elements TX/RX for wireless docking is described. The RFIC is packaged with a 6×6 patch antenna on LTCC creating a 25mm × 25mm LGA package having an antenna gain of 19dBi and ~2dB routing loss. The TX total EIRP is 29dBm at -19dB EVM with scanning of +/-30deg. The RFIC is also packaged with two 2×16 slot loop antenna on high density PCB with 17dBi peak gain and steering of up to +/-50deg.
Keywords :
CMOS analogue integrated circuits; antenna phased arrays; field effect MMIC; integrated circuit packaging; loop antennas; microstrip antenna arrays; printed circuits; slot antenna arrays; LGA package; TX-RX phased array RFIC; antenna gain; antenna packaging; frequency 60 GHz; high-density PCB; integrated CMOS phased array antenna module; patch antenna; peak gain; routing loss; slot loop antenna; transmitter total EIRP; wireless docking; Antenna measurements; Arrays; Phased arrays; Radiofrequency integrated circuits; Routing; 60GHz; Antenna in package; LTCC; Phased array; conformal package;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2013 IEEE International Conference on
Conference_Location :
Tel Aviv
Type :
conf
DOI :
10.1109/COMCAS.2013.6685306
Filename :
6685306
Link To Document :
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