Antenna packaging of a 32 element TX/RX phased array RFIC for 60 GHz communications

Author

Cohen, Emmanuel ; Ruberto, Mark ; Cohen, Moshik ; Pan, Helen K. ; Ravid, Shmuel

Author_Institution

Mobile Wireless Group, Intel Haifa, Haifa, Israel

fYear

2013

fDate

21-23 Oct. 2013

Firstpage

1

Lastpage

5

Abstract

An integrated CMOS 60GHz phased array antenna module supporting symmetrical 32 elements TX/RX for wireless docking is described. The RFIC is packaged with a 6×6 patch antenna on LTCC creating a 25mm × 25mm LGA package having an antenna gain of 19dBi and ~2dB routing loss. The TX total EIRP is 29dBm at -19dB EVM with scanning of +/-30deg. The RFIC is also packaged with two 2×16 slot loop antenna on high density PCB with 17dBi peak gain and steering of up to +/-50deg.

Keywords

CMOS analogue integrated circuits; antenna phased arrays; field effect MMIC; integrated circuit packaging; loop antennas; microstrip antenna arrays; printed circuits; slot antenna arrays; LGA package; TX-RX phased array RFIC; antenna gain; antenna packaging; frequency 60 GHz; high-density PCB; integrated CMOS phased array antenna module; patch antenna; peak gain; routing loss; slot loop antenna; transmitter total EIRP; wireless docking; Antenna measurements; Arrays; Phased arrays; Radiofrequency integrated circuits; Routing; 60GHz; Antenna in package; LTCC; Phased array; conformal package;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwaves, Communications, Antennas and Electronics Systems (COMCAS), 2013 IEEE International Conference on

Conference_Location

Tel Aviv

Type

conf

DOI

10.1109/COMCAS.2013.6685306

Filename

6685306