DocumentCode
65539
Title
Measurements and Simulations of Low Dark Count Rate Single Photon Avalanche Diode Device in a Low Voltage 180-nm CMOS Image Sensor Technology
Author
Leitner, Thomas ; Feiningstein, A. ; Turchetta, R. ; Coath, Rebecca ; Chick, Steven ; Visokolov, G. ; Savuskan, V. ; Javitt, M. ; Gal, Laszlo ; Brouk, Igor ; Bar-Lev, Sharon ; Nemirovsky, Yael
Author_Institution
TOWERJAZZ Specialty Foundry, Migdal Haemek, Israel
Volume
60
Issue
6
fYear
2013
fDate
Jun-13
Firstpage
1982
Lastpage
1988
Abstract
This paper presents the key features of single photon avalanche diode (SPAD) devices fabricated in a low voltage commercial 180-nm CMOS image sensor technology exhibiting very low dark count rate (DCR). The measured DCR is <; 100 Hz at room temperature even for excess voltages above 2 V. The active junction of the SPAD measures 10 μm in diameter within a 24-μm test structure. The active region where Geiger avalanche occurs is determined by an implanted charge sheet. Edge avalanche is averted by utilizing a virtual guard ring, formed by the retrograde well profile. The design, measurements, and simulations of doping and electric field profiles that lead to such low DCR are reported and analyzed. The current-voltage characteristics and the temperature dependence of the breakdown voltage provide further, indirect evidence for the low DCR measured in the device. Thus, the key features of measured good SPADs are presented and are correlated with simulations that give physical insight on how to design high-performance SPADs.
Keywords
CMOS image sensors; avalanche diodes; doping profiles; electric breakdown; semiconductor device testing; DCR measurement; Geiger avalanche; SPAD active junction; SPAD device fabrication; breakdown voltage; charge sheet implantation; current-voltage characteristics; doping simulations; edge avalanche; electric field profiles; high-performance SPAD design; low dark count rate single photon avalanche diode device measurements; low dark count rate single photon avalanche diode device simulations; low voltage commercial CMOS image sensor technology; size 10 mum; size 180 nm; size 24 mum; temperature 293 K to 298 K; temperature dependence; test structure; virtual guard ring; Avalanche breakdown; image sensors; photodiodes; semiconductor device measurement; single photon avalanche diode (SPAD);
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/TED.2013.2259172
Filename
6517019
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