Title :
End-fire antenna-in-package solution for millimeter-wave applications in a Teflon-based PCB technology
Author :
Enayati, A. ; De Raedt, W. ; Ocket, I. ; Vandenbosch, Guy A. E.
Author_Institution :
RF Component Design & Modeling Group, Inter-Univ. Microelectron. Center (IMEC), Leuven, Belgium
Abstract :
An antenna-in-package solution for millimeter-wave applications has been introduced. The antenna which has an antipodal Vivaldi architecture has been implemented in a multilayer Teflon-based PCB technology. This technology not only helps to reduce the interconnect losses but because of its multilayer stack also allows for promising integration ideas. The antenna which has an end-fire radiating pattern has been measured for its electrical performance such as gain and return loss. Its return loss is better than 10 dB from 40 GHz to 90 GHz. Also it shows gain values of about 4.5 dB with a deviation of less than 1 dB from 57 GHz to 66 GHz which makes it a promising choice for 60-GHz communication systems.
Keywords :
antenna radiation patterns; chip scale packaging; integrated circuit interconnections; losses; microwave antenna arrays; millimetre wave antenna arrays; polymers; printed circuit interconnections; printed circuits; antipodal Vivaldi architecture; communication systems; electrical performance; end-fire antenna radiation pattern measurement; end-fire antenna-in-package solution; frequency 40 GHz to 90 GHz; frequency 57 GHz to 66 GHz; frequency 60 GHz; interconnect loss reduction; millimeter wave application; multilayer Teflon-based PCB technology; multilayer stack; return loss; Antenna measurements; Antenna radiation patterns; Dipole antennas; Gain; Laminates; Loss measurement; Antenna-in-package; antipodal Vivaldi antenna; millimeter-wave communications; multilayer PCB;
Conference_Titel :
Microwave Conference (EuMC), 2013 European
Conference_Location :
Nuremberg
