Broad frequency LTCC vertical interconnect transition for multichip modules and system on package applications

Author

Decrossas, Emmanuel ; Glover, Michael D. ; Porter, Kaoru ; Cannon, Tom ; Mantooth, Homer Alan ; Hamilton, Michael C.

Author_Institution

Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA

fYear

2013

fDate

6-10 Oct. 2013

Firstpage

104

Lastpage

107

Abstract

Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4mm connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont™ 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from DC to 50 GHz and beyond.

Keywords

ceramic packaging; flip-chip devices; integrated circuit interconnections; multichip modules; strip lines; system-in-package; DuPont 9K7 green tape; LTCC substrates; broad frequency LTCC vertical interconnect transition; edge launch connectors; flip chip interconnect designs; high-speed digital communication systems; low temperature cofired ceramic substrates; multichip modules; signal integrity; size 2.4 mm; stripline structures; stripline transmission lines; system on package applications; transition designs; Cavity resonators; Fabrication; Microstrip; Resonant frequency; Stripline; Substrates; Transmission line measurements; Full-tape-thickness feature; LTCC 9K7 interconnect; multi-chip-module (MCM); quasi-coaxial vertical transition; signal integrity; system on package (SOP);

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference (EuMC), 2013 European

Conference_Location

Nuremberg

Type

conf

Filename

6686601