Ultra wideband D-band antenna integrated in a LTCC based QFN package using a flip-chip interconnect

This paper investigates a packaging solution for single chip applications at D-band frequencies. A broadband planar antenna is integrated in a LTCC based QFN package using a flip-chip interconnect to the MMIC dummy. Hence it is shown that a broadband millimeter wave flip-chip interconnect is realizable by a gold stud bump technology without the use of a subsequent matching network. Additionally the plastic lid has minimal influence to the overall performance of the Antenna in Package (AiP) which is shown by probe based measurements. The relative bandwidth is about 30 %, a high gain from 7 to 14 dBi is achieved in the frequency range from 120 - 170 GHz.