• DocumentCode
    655676
  • Title

    Electromagnetic field analysis with advanced structural modeling of microstrips on porosified LTCC

  • Author

    Talai, Armin ; Weigel, Robert ; Koelpin, Alexander ; Gmeiner, B. ; Ruede, Ulrich ; Steinhausser, F. ; Bittner, Achim ; Schmid, Ulrich

  • Author_Institution
    Inst. for Electron. Eng., Friedrich-Alexander-Univ., Erlangen, Germany
  • fYear
    2013
  • fDate
    6-10 Oct. 2013
  • Firstpage
    440
  • Lastpage
    443
  • Abstract
    Recent investigations demonstrated that porosification offers the possibility of high quality antenna integration on LTCC by local reduction of the relative permittivity. In order to take advantage of this technology, further research for the deposition of conductors on porosified areas has to be done. Since the near-surface material removal is strong, conductors are expected to penetrate substantially into the porosified substrate. In this paper a new, randomized structural modeling technique of porosified LTCC is presented, which is based on scanning electron microscope imaging. Finite 3D field simulations, performed with this model, show the electromagnetic effects of different vertical microstrip positions on the effective permittivity and the corresponding scattering parameters.
  • Keywords
    antenna theory; conductors (electric); electromagnetic fields; microstrip antennas; permittivity; scanning electron microscopy; advanced structural modeling; conductor deposition; electromagnetic effects; electromagnetic field analysis; finite 3D field simulations; high quality antenna integration; low temperature cofired ceramics; near-surface material removal; porosified LTCC; randomized structural modeling technique; relative permittivity; scanning electron microscope imaging; scattering parameters; vertical microstrip positions; Computational modeling; Conductors; Etching; Permittivity; Solid modeling; Substrates; Field simulation; LTCC; inhomogeneous substrate; porosification; reduction of permittivity; structural modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference (EuMC), 2013 European
  • Conference_Location
    Nuremberg
  • Type

    conf

  • Filename
    6686686