Title :
Low-cost E-band receiver front-end development for gigabyte point-to-point wireless communications
Author :
Ghassemi, Nasser ; Gauthier, John ; Ke Wu
Author_Institution :
Poly-Grames Res. Center, Ecole Polytech. (Univ. of Montreal), Montreal, QC, Canada
Abstract :
This paper presents an attractive low cost E-band (81-86 GHz) receiver front-end system with a broad bandwidth (up to 5 GHz) based on substrate integrated waveguide (SIW) technology. The proposed subsystem is designed for gigabyte point-to-point wireless communication system. Active components are surface-mounted on alumina substrate utilizing miniature hybrid microwave-integrated circuit (MHMIC) technology. To increase gain and bandwidth of the antenna, and also to reduce fabrication cost, antenna and passive components are designed and fabricated on a low cost Rogers 6002 substrate with low dielectric constant. To fabricate the passive components, low cost printed circuit board (PCB) process is used. Then, the two substrates are integrated together by simple wire bonding process. With this design and implementation technique, our E-band front-end receiver subsystem can demonstrate attractive advantages and features such as broad bandwidth, low cost, compact size, light weight, and repayable performance. The minimum detectable power density at the receiver point is 0.41 μW/cm2 and the dynamic range is 72 dB.
Keywords :
alumina; hybrid integrated circuits; lead bonding; microwave integrated circuits; millimetre wave antennas; printed circuits; radiocommunication; substrate integrated waveguides; E-band front-end receiver subsystem; MHMIC technology; SIW technology; active components; alumina substrate; antenna bandwidth; antenna gain; dielectric constant; fabrication cost reduction; frequency 81 GHz to 86 GHz; gigabyte point-to-point wireless communications; low-cost E-band receiver front-end development; low-cost PCB process; low-cost Rogers 6002 substrate; low-cost printed circuit board process; miniature hybrid microwave-integrated circuit technology; minimum detectable power density; passive component; substrate integrated waveguide technology; wire bonding process; Antenna arrays; Antenna measurements; Arrays; Bandwidth; Receivers; Substrates; Wireless communication; E-band; Gigabyte communication; Wideband receiver front-end; millimeter-wave; point to point communication; substrate integrated waveguide (SIW);
Conference_Titel :
Microwave Conference (EuMC), 2013 European
Conference_Location :
Nuremberg