Title :
Modeling of InP HBTs in transferred-substrate technology for millimeter-wave applications
Author :
Johansen, Tom K. ; Rudolph, Matthias ; Jensen, T. ; Kraemer, T. ; Weimann, Nils ; Schnieder, Frank ; Krozer, V. ; Heinrich, Wolfgang
Author_Institution :
Dept. of Electr. Eng., Tech. Univ. of Denmark, Lyngby, Denmark
Abstract :
In this paper, the modeling of InP heterojunction bipolar transistors (HBTs) in transferred substrate (TS) technology is investigated. At first, a direct parameter extraction methodology dedicated to III-V based HBTs is employed to determine the small-signal equivalent circuit parameters from measured S-parameters. It is shown that the model prediction of measured S-parameters can be improved in the millimeter-wave frequency range by augmenting the small-signal model with a description of AC current crowding. The extracted elements of the small-signal model structure are employed as a starting point for the extraction of a large-signal model. The developed large-signal model for the TS-HBTs accurately predicts the DC over temperature and small-signal performance over bias as well as the large-signal performance at millimeter-wave frequencies (77 GHz).
Keywords :
III-V semiconductors; S-parameters; heterojunction bipolar transistors; indium compounds; millimetre wave bipolar transistors; AC current crowding; III-V-based HBT; TS technology; direct parameter extraction methodology; frequency 77 GHz; indium phosphide HBT; indium phosphide heterojunction bipolar transistors; large-signal model; measured S-parameters; millimeter-wave application; millimeter-wave frequencies; millimeter-wave frequency range; small-signal equivalent circuit parameters; small-signal model; small-signal model structure; small-signal performance; transferred substrate technology; transferred-substrate technology; Capacitance; Current measurement; Equivalent circuits; Heterojunction bipolar transistors; Integrated circuit modeling; Resistance; Heterojunction bipolar transistor (HBT); InP; equivalent circuit modeling; parameter extraction; transferred substrate;
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2013 European
Conference_Location :
Nuremberg