• DocumentCode
    656655
  • Title

    Liquid crystal and infrared thermography on coated SAW devices

  • Author

    Huck, C. ; Zidek, H.P. ; Ebner, Thomas ; Wagner, K.C. ; Wixforth, Achim

  • Author_Institution
    Inst. of Phys., Univ. of Augsburg, Augsburg, Germany
  • fYear
    2013
  • fDate
    6-8 Oct. 2013
  • Firstpage
    452
  • Lastpage
    455
  • Abstract
    Reliability of micro-electronic devices is one of the most important issues in mobile communication systems and is significantly influenced by the thermal behavior of the components. The present contribution demonstrates Liquid Crystal Thermography (LCT) and Infrared Thermography (IRT) in exemplary investigations of self-heating effects in a half-section ladder-type Surface Acoustic Wave (SAW) filter with thick SiO2 coating. Conventionally, mean temperature values are obtained indirectly by evaluating measured frequency shifts under load using the Temperature Coefficient of Frequency (TCF). In contrast to TCF based evaluations, LCT and IRT provide spatially resolved measurements of the temperature distribution on the component and serve as an independent and direct scheme for thermal characterizations. The results of LCT and IRT measurements are compared with simulations of the temperature distribution and show good agreement.
  • Keywords
    coating techniques; infrared imaging; liquid crystal devices; silicon compounds; surface acoustic wave filters; temperature distribution; IRT measurements; LCT measurements; SAW filter; SiO2; TCF based evaluations; coated SAW devices; half-section ladder-type surface acoustic wave filter; infrared thermography; liquid crystal thermography; microelectronic devices; mobile communication systems; reliability; self-heating effects; temperature coefficient of frequency; temperature distribution; thermal behavior; thermal characterizations; thick coating; Calibration; Frequency measurement; Liquid crystals; Semiconductor device measurement; Surface treatment; Temperature distribution; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Integrated Circuits Conference (EuMIC), 2013 European
  • Conference_Location
    Nuremberg
  • Type

    conf

  • Filename
    6687883