DocumentCode :
656688
Title :
A 60-GHz high-gain, low-power, 3.7-dB noise-figure low-noise amplifier in 90-nm CMOS
Author :
Hsin-Chih Kuo ; Huey-Ru Chuang
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2013
fDate :
6-8 Oct. 2013
Firstpage :
584
Lastpage :
587
Abstract :
This paper presents a 60-GHz high-gain, low-power, 3.7-dB noise-figure (NF), CMOS low-noise amplifier (LNA) fabricated with a 90-nm process. The CMOS LNA exhibited a two-stage cascode structure with a common-source buffer amplifier. To achieve a lower NF and to prevent poor linearity, an inter-stage noise matching inductor and a derivative superposition method were applied to the LNA design. A thin-film microstrip (TFMS) line was used for matching networks and all interconnections. The TFMS line consists of a top metal layer (M9) serving as the signal microstrip line and a bottom metal layer (M1) serving as the ground plane. The measurement results showed that the proposed LNA exhibited the best gain performance of 22 dB at 57.3 GHz and a minimum NF of 3.7 dB at 61 GHz. The input third-order intercept point was -13 dBm. Further, the proposed LNA dissipated a total power of 13.5 mW from a 1.5 V power supply.
Keywords :
CMOS analogue integrated circuits; low noise amplifiers; low-power electronics; millimetre wave amplifiers; millimetre wave integrated circuits; thin film circuits; CMOS; LNA design; NF; TFMS line; bottom metal layer; common-source buffer amplifier; derivative superposition method; frequency 57.3 GHz; frequency 61 GHz; gain 22 dB; ground plane; inter-stage noise matching inductor; low-power amplifier; noise figure 3.7 dB; noise-figure amplifier; power 13.5 mW; signal microstrip line; size 90 nm; thin-film microstrip line; top metal layer; two-stage cascode structure; voltage 1.5 V; CMOS integrated circuits; Frequency measurement; Gain; Inductors; Linearity; Noise; Noise measurement; 60-GHz; derivative superposition; low-noise amplifier (LNA); noise matching; thin-film microstrip (TFMS) line;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave Integrated Circuits Conference (EuMIC), 2013 European
Conference_Location :
Nuremberg
Type :
conf
Filename :
6687916
Link To Document :
بازگشت