Title :
Wafer bonding for vacuum encapsulated MEMS
Author :
Dragoi, Viorel ; Pawlak, M. ; Flotgen, C. ; Mittendorfer, G. ; Pabo, E.
Author_Institution :
EV Group, St. Florian, Austria
Abstract :
The working principle of various categories of MEMS devices require inside the packages the encapsulation of vacuum ambient which impacts on device performance. The factors impacting on process choice will be reviewed. Main wafer bonding processes used for such applications will be introduced.
Keywords :
encapsulation; micromechanical devices; wafer bonding; MEMS device; vacuum encapsulation; wafer bonding process; Bonding; Cavity resonators; Gettering; Glass; Micromechanical devices; Wafer bonding;
Conference_Titel :
Semiconductor Conference (CAS), 2013 International
Conference_Location :
Sinaia
Print_ISBN :
978-1-4673-5670-1
Electronic_ISBN :
1545-827X
DOI :
10.1109/SMICND.2013.6688075
