DocumentCode
657024
Title
Implantable chips and sensors: Quo vadis?
Author
Puers, Robert
Author_Institution
ESAT-MICAS, KU Leuven, Leuven, Belgium
fYear
2013
fDate
3-6 Nov. 2013
Firstpage
1
Lastpage
2
Abstract
The talk discusses the ongoing evolutions in miniaturizing active medical implants by bringing microsystem technology to the next level in terms of integration, miniaturization and multi-functionality and applying this development to address pending needs in health care.
Keywords
biomedical electronics; microsensors; prosthetics; active medical implant miniaturization; health care application; implantable chips; implantable sensor; microsystem technology; Consumer electronics; Implants; Materials; Micromechanical devices; Monitoring; Packaging; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
SENSORS, 2013 IEEE
Conference_Location
Baltimore, MD
ISSN
1930-0395
Type
conf
DOI
10.1109/ICSENS.2013.6688305
Filename
6688305
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