Title :
Implantable chips and sensors: Quo vadis?
Author_Institution :
ESAT-MICAS, KU Leuven, Leuven, Belgium
Abstract :
The talk discusses the ongoing evolutions in miniaturizing active medical implants by bringing microsystem technology to the next level in terms of integration, miniaturization and multi-functionality and applying this development to address pending needs in health care.
Keywords :
biomedical electronics; microsensors; prosthetics; active medical implant miniaturization; health care application; implantable chips; implantable sensor; microsystem technology; Consumer electronics; Implants; Materials; Micromechanical devices; Monitoring; Packaging; Transducers;
Conference_Titel :
SENSORS, 2013 IEEE
Conference_Location :
Baltimore, MD
DOI :
10.1109/ICSENS.2013.6688305
