Title :
Towards the world smallest wireless sensor nodes with low power consumption for ‘Green’ sensor networks
Author :
Lu, Jun ; Okada, H. ; Itoh, Takayuki ; Maeda, Ryutaro ; Harada, Tatsuya
Author_Institution :
Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
Abstract :
Pursuit of the lowest size-limit of wireless sensor node may not only reduce production cost and power consumption, but also enable its layout-free ubiquitous applications, especially in `green´ sensor network to compress energy consumption through visibility and optimization. In this work, we engage in developing the world smallest wireless sensor node form both system block integration and physical interconnection points-of-view. A customized RF-transmitter IC with low power consumption, universal interface to analog and digital sensors, and power management function was developed by using 0.18um 1.8V/3.3V 1P6M logic process. By introducing buried bump interconnection technology (B2it™), one of the world smallest wireless sensor nodes for humidity and temperature monitoring was successfully achieved with the size of 3.9×3.9×3.5mm. Configuration of above sensor node also enables its easy assembly with stand-alone power source and flexible antenna for wide variety of applications.
Keywords :
antennas; interconnections; logic circuits; power consumption; radiofrequency integrated circuits; wireless sensor networks; 1P6M logic process; B2it; analog sensors; buried bump interconnection technology; customized RF-transmitter IC; digital sensors; flexible antenna; green sensor networks; humidity monitoring; low power consumption; physical interconnection; power management function; size 0.18 mum; stand-alone power source; system block integration; temperature monitoring; universal interface; voltage 1.8 V to 3.3 V; wireless sensor nodes; Assembly; Green products; Integrated circuits; Prototypes; Temperature sensors; Wireless communication; Wireless sensor networks;
Conference_Titel :
SENSORS, 2013 IEEE
Conference_Location :
Baltimore, MD
DOI :
10.1109/ICSENS.2013.6688357