• DocumentCode
    657090
  • Title

    Extending upper cutoff frequency of electrochemical seismometer by using extremely thin Su8 insulating spacers

  • Author

    He, W.T. ; Chen, D.Y. ; Wang, J.B. ; Chen, Jiann-Jong ; Deng, T.

  • Author_Institution
    State Key Lab. of Transducer Technol., Inst. of Electron., Beijing, China
  • fYear
    2013
  • fDate
    3-6 Nov. 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Here we presented a scheme based on MEMS technology to manufacture electrochemical seismometers and improved the seismometers´ high-frequency property. This device contained 2 pairs of perforated electrodes and 3 pieces of insulating spacers. Numerical simulations indicated the upper cutoff frequency fc of the devices was related not just to the radium of holes in electrodes but to insulating spacers´ thickness. A thin layer of Su8 torn off from the substrate by a special craft was chosen to fabricate insulating spacer, and to ensure proper size of hole in electrodes and good consistency of electrodes, silicon wafers covered with platinum were applied to fabricate electrodes. Through this method we could obtain insulating spacers 300-5μm thick. Finally, we demonstrated, the upper cutoff frequency of the devices was expend to 50Hz by reducing the spacers´ thickness to 30μm, without any circuit compensation. Meanwhile, devices´ low frequency properties weren´t affected.
  • Keywords
    electrochemical electrodes; electrochemical sensors; elemental semiconductors; insulating thin films; microfabrication; microsensors; numerical analysis; polymer films; seismometers; silicon; thin film sensors; velocimeters; MEMS technology; Si; electrochemical seismometer; frequency 50 Hz; high-frequency property; numerical simulation; perforated electrode fabrication; silicon wafer; size 300 mum to 5 mum; thin Su8 insulating spacer fabrication; upper cutoff frequency; Cathodes; Cutoff frequency; Mathematical model; Noise; Silicon; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SENSORS, 2013 IEEE
  • Conference_Location
    Baltimore, MD
  • ISSN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2013.6688372
  • Filename
    6688372