Title :
A monocrystalline absolute pressure sensor with a pseudo-MOSFET read-out device for life-science applications
Author :
Ebschke, S. ; Poloczek, R.R. ; Kallis, K.T. ; Fiedler, H.L.
Author_Institution :
Intell. Microsyst. Inst., Tech. Univ. Dortmund, Dortmund, Germany
Abstract :
Based on silicon on insulator (SOI) technology, a novel absolute pressure sensor with a pseudo-MOSFET read-out is designed and fabricated, in which a buried silicon dioxide layer in the silicon material is the sacrifice layer for the cavity. The membrane is a monocrystalline silicon top layer which contains nanoholes (120 nm × 2 μm) created by electron-beam lithography [1]. These nano-holes are used for isotropic etching of the cavity into the buried oxide (BOX). This idea based on the previous work of Lee et al. [2] and Sato et al. [3]. To encapsulate the cavity the holes are sealed by using non-stressed PECVD-nitride. The drain- and source-connections of the pseudo-MOSFET are compounded by evaporation of aluminum on top of the membrane and a backside metallization is attached for the gate connection. The experimental results show that this kind of sensor possesses good static performance, which meet the sophisticated pressure measurement demands of the medical industry.
Keywords :
MOSFET; biomedical electronics; biomedical transducers; blood pressure measurement; electron beam lithography; elemental semiconductors; encapsulation; etching; evaporation; membranes; nanosensors; nanostructured materials; plasma CVD; pressure sensors; readout electronics; semiconductor device metallisation; silicon; silicon compounds; silicon-on-insulator; BOX; SOI technology; Si-SiO2; backside metallization; blood pressure measurement; buried oxide; buried silicon dioxide layer; drain-source-connection; electron-beam lithography; encapsulation; evaporation; isotropic etching; life-science application; medical industry; membrane; monocrystalline absolute pressure sensor; nanohole; nonstressed PECVD-nitride; pseudoMOSFET read-out device; sacrifice cavity layer; sealing; silicon on insulator technology; source-connection; Aluminum; Cavity resonators; Fabrication; Logic gates; Silicon; Silicon compounds; Stress;
Conference_Titel :
SENSORS, 2013 IEEE
Conference_Location :
Baltimore, MD
DOI :
10.1109/ICSENS.2013.6688458