An exothermal energy release layer for microchip transience

A single layer nanothermite spin coated gel has been utilized as a solid-state exothermic energy release layer for triggered microchip transience. A proportional combination of self-assembled CuO/Al nanothermite and Napalm-B as gelling agent has been used to develop for the first time a spinable nanothermite film onto the surface of a micro-chip. This layer when ignited instantaneously releases enough heat energy to melt the surface of the underlying substrate and any surface-bound microdevices, electronic feature or any surface deposited component. We observe the effect of thermite enabled destruction prior and post ignition through microscopic imaging and electrical measurements on surface bound components.