Experimental Characterization of Hybrid Solid-State and Fluidic Cooling for Thermal Management of Localized Hotspots

Author

Sahu, Vivek ; Joshi, Yogendra K. ; Fedorov, Andrei G. ; Je-Hyeong Bahk ; Xi Wang ; Shakouri, Ali

Author_Institution

George W.Woodruff Sch. of Mech. Eng., Georgia Inst. of Technol., Austin, GA, USA

Volume

5

Issue

1

fYear

2015

fDate

Jan. 2015

Firstpage

57

Lastpage

64

Abstract

A hybrid cooling scheme utilizing superlattice coolers (SLCs) along with microchannel heat sink for thermal management of hotspots is presented. In this paper, we have studied the effect of operating and design parameters on the performance of the SLC. We have also experimentally investigated the effect of interface thermal resistance as well as thermal resistance between the ground electrode and superlattice using two test configurations: one with on-chip microchannels and another with off-chip microchannels. We demonstrated heat removal capability at the localized hotspots of more than over 300 W/cm².

Keywords

cooling; earth electrodes; heat sinks; microchannel flow; superlattices; thermal management (packaging); fluidic cooling; ground electrode; hybrid cooling scheme; hybrid solid-state; interface thermal resistance; localized hotspots; microchannel heat sink; off-chip microchannels; on-chip microchannels; superlattice coolers; thermal management; Heat sinks; Microchannels; Resistance heating; Superlattices; Temperature measurement; Hotspot cooling; hybrid cooling; microchannel heat sink; superlattice cooler (SLC); thermal management; thermal management.;

fLanguage

English

Journal_Title

Components, Packaging and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-3950

Type

jour

DOI

10.1109/TCPMT.2014.2332516

Filename

6971117