Title :
Analysis on the time-domain transfer characteristics of UWB TEM horn antenna
Author :
Dongdong Wang ; Shengquan Zheng ; Feng Deng ; Dongyun Hou
Author_Institution :
Sci. & Technol. on Electromagn. Compatibility Lab., China Ship Dev. & Design Center, Wuhan, China
Abstract :
In this paper, the time-domain field-to-circuit transfer characteristics of UWB TEM horn antenna were studied with analytical method and simulation method respectively. To obtain the electric field waveform in the far-filed region of the TEM horn excited by any voltage sources, we could first get the coupled voltage waveform of the antenna illuminated by impulse-like incident plane wave by means of experiments or simulation, and then make convolution of the coupled voltage and the excited voltage. So that rE, the field-distance product, will be acquired by multiplying the convolution result with a certain constant. It was observed that while the opening angle and azimuth angle of the TEM horn were kept unchanged, the value of rE growed larger as the length of the two conducting plates of the horn increased. If the volume of the TEM horn scaled up, the amplitude of second-time radiation pulse, resulting from mismatch between the impedance of the TEM horn and free space, stayed the same, but the delay between the second-time radiation and the main pulse increased, which equaled to 2*l/c, where l was the length of the TEM horn´s conducting plate and c the speed of light.
Keywords :
horn antennas; time-domain analysis; ultra wideband antennas; UWB TEM horn antenna; azimuth angle; coupled voltage waveform; electric field waveform; field-distance product; impulse-like incident plane wave; opening angle; second-time radiation pulse amplitude; time-domain transfer characteristics analysis; voltage sources; Cutoff frequency; Electric fields; Horn antennas; Receiving antennas; Time-domain analysis; Ultra wideband antennas; TEM horn; UWB; time domain; transfer characteristic;
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4673-6077-7
DOI :
10.1109/MAPE.2013.6689819