DocumentCode
658172
Title
A novel compact antenna of radio altimeters based on bi-layer substrate technology
Author
Aixin Chen ; Xiaojun Ying ; Kejia Ding
Author_Institution
Sch. of Electron. & Inf. Eng., Beihang Univ., Beijing, China
fYear
2013
fDate
29-31 Oct. 2013
Firstpage
402
Lastpage
405
Abstract
In this paper, a novel compact antenna of radio altimeter based on bi-layer substrate is presented, which is composed of bi-layer microwave circuits. A palisade-shaped conductor is placed on the upper substrate to enhance purity of the linear polarization, while a two-unit parallel-fed microstrip antenna array and its feeding network are laid on the lower substrate. This new kind of radio altimeter antenna may be installed on certain air vehicle with small scale. The bi-layer substrate has a size of 56mm×36mm×3mm, and the outline of the antenna is of 65mm×60mm×6mm.The simulated and measured results indicate that the half-power beamwidth of this novel altimeter antenna is about ±33° × ±37°, and the 2:1 voltage standing wave ratio(VSWR) bandwidth is about 210MHz, with a 8 dB max gain. Also we measured the isolation between two antennas of radio altimeter with a distance of 500mm, and the final isolation value is more than 50dB in its working frequency range. As the altimeter antenna has good performance in beamwidth, bandwidth, and isolation, together with a compact structure, it will have promising future for application.
Keywords
altimeters; antenna feeds; microwave antennas; microwave circuits; radio equipment; bi-layer microwave circuits; bi-layer substrate technology; compact antenna; enhance purity; feeding network; gain 8 dB; linear polarization; palisade-shaped conductor; radio altimeters; two-unit parallel-fed microstrip antenna array; voltage standing wave ratio; Antenna arrays; Conductors; Microstrip; Microstrip antennas; Substrates; Vehicles; Linear polarization; Microstrip antennas; Radio Altimeters; VSWR;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
Conference_Location
Chengdu
Print_ISBN
978-1-4673-6077-7
Type
conf
DOI
10.1109/MAPE.2013.6689832
Filename
6689832
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