DocumentCode :
658240
Title :
Research on electromagnetic compatibility testing indexes based on statistical process control
Author :
Yumei Wang ; Kai Zhang ; Li Yan
Author_Institution :
China Ship Dev. & Design Center, Wuhan, China
fYear :
2013
fDate :
29-31 Oct. 2013
Firstpage :
555
Lastpage :
558
Abstract :
A method analyzing EMC testing indexes is proposed based on the Statistical Process Control. Adopting this method, we firstly collect testing data accumulated in engineering practice, then recur to the statistical analyze, paint control chart, evaluate the steady state of electromagnetism characteristic and assistant decision makings about testing parameters. Differencing from the conventional applications of Statistical Process Control, we needn´t discover the exceptional factors based on the feedback information or take corresponding measures to eliminate influence; Also based on the testing data analysis, this method avoids large amount of modeling and simulating numeration and is simple and convenient, which will be a great favor in complex circumstance where it is difficult or impossible to establish simulating models. To illustrate how this method be carried out in practice, we analyze the super scales of a typical electromagnetic emission item step by step, and give some advices based on the results at last.
Keywords :
data analysis; electromagnetic compatibility; statistical analysis; statistical process control; EMC testing indexes; assistant decision makings; data analysis; electromagnetic compatibility testing indexes; electromagnetic emission; electromagnetism characteristic; statistical process control; Control charts; Electromagnetic compatibility; Electromagnetics; Fluctuations; Marine vehicles; Process control; Testing; Electromagnetic Compatibility; Statistical Process Control; Testing Indexes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4673-6077-7
Type :
conf
DOI :
10.1109/MAPE.2013.6689900
Filename :
6689900
Link To Document :
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