• DocumentCode
    658247
  • Title

    Analysis of the terminal response characteristics of a single twisted-wire pair excited by HEMP

  • Author

    Tao Hu ; Qifeng Liu ; Shengquan Zheng ; Yao Hu ; Xueqin Yi

  • Author_Institution
    Sci. & Technol. on Electromagn. Compatibility Lab., Wuhan, China
  • fYear
    2013
  • fDate
    29-31 Oct. 2013
  • Firstpage
    586
  • Lastpage
    590
  • Abstract
    It is great harmful that High-altitude nuclear electromagnetic pulse (HEMP) can directly couple energy into the interior through apertures or wires. As the twist wire pair (TWP) is an important coupling way, studying the coupling of the twist wire pair excited by HEMP is very necessary in practice. The interference coupling response of the twist wire pair with the case that the incident wave is HEMP is computed by using an efficient matrix procedure based on the transmission line model (TLM). In this paper, closed-form analytic approximations of the terminal response valid for an arbitrary direction of incidence and polarization of the incoming plane-wave field are provided in the frequency. And the transient waveforms are computed by an inverse discrete Fourier transformation. Then this paper discusses what happens when a fraction of a turn is present at the end.
  • Keywords
    discrete Fourier transforms; electromagnetic pulse; twisted pair cables; HEMP; closed-form analytic approximations; high-altitude nuclear electromagnetic pulse; incident wave; incoming plane-wave field; interference coupling response; inverse discrete Fourier transformation; single twisted-wire pair; terminal response characteristics; transient waveforms; transmission line model; Computational modeling; Couplings; EMP radiation effects; Power dissipation; Power transmission lines; Vectors; Wires; Electromagnetic pulse; coupling model; transmission-line theory; twisted wire pair;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4673-6077-7
  • Type

    conf

  • DOI
    10.1109/MAPE.2013.6689907
  • Filename
    6689907