Title :
Analysis and simulation of the Crosstalk between High voltage cables and low voltage signal lines in EMU
Author :
Dan Zhang ; Yinghong Wen ; Jinbao Zhang ; Lan Ma
Author_Institution :
Beijing Jiaotong Univ. Electromagn. Compatibility Lab., Beijing, China
Abstract :
Aiming at the coupling problem between CRH3G EMU 25 kV High Voltage Cable and sensor cables under the train, this paper extends the basic theory of transmission line and establishes the crosstalk theoretical model for the two kinds of commonly used shielded cables. According the arrangement of sample train, the transmission line is divided into two sections for solving the problem of different length of parallel transmission lines. Firstly, the relationship between voltage and current at one point is built. Then two equivalent harassment sources of the 25 kV High Voltage Cable core and screen are proposed at the beginning of parallel wiring part. After that time domain feature of crosstalk is analyzed by using the Finite difference time domain method, thereby the fulmar of transmission line piecewise matrix is proposed. In view of the actual situation, using 1 kV Gaussian pulse modulation as excitation source of 25 kV High Voltage Cable. The results show that, under these conditions the crosstalk can not affect the normal work of sensors.
Keywords :
Gaussian processes; cable shielding; crosstalk; finite difference time-domain analysis; matrix algebra; power cables; power transmission lines; EMU; Gaussian pulse modulation; crosstalk theoretical model; equivalent harassment sources; excitation source; finite difference time domain method; high voltage cable core; high voltage cable screen; high voltage cables; low voltage signal lines; parallel transmission lines; parallel wiring; sensor cables; shielded cables; time domain feature; transmission line piecewise matrix; Couplings; Crosstalk; Power cables; Temperature sensors; Time-domain analysis; Transmission line matrix methods; CRH3G; High Voltage Cable; crosstalk; electromagnetic; sensor cables;
Conference_Titel :
Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
Conference_Location :
Chengdu
Print_ISBN :
978-1-4673-6077-7
DOI :
10.1109/MAPE.2013.6689918