• DocumentCode
    658265
  • Title

    A compact 8×8 Butler matrix based on double-layer structure

  • Author

    Kejia Ding ; Fei He ; Xiaojun Ying ; Jian Guan

  • Author_Institution
    Res. Inst. of Unmanned Aerial Vehicle, Beihang Univ., Beijing, China
  • fYear
    2013
  • fDate
    29-31 Oct. 2013
  • Firstpage
    650
  • Lastpage
    653
  • Abstract
    In this paper, a novel 8×8 Butler matrix based on double-layer substrate structure is presented and realized. The double-layer structure is adopted to place components on the up and down layers without crossover. Two-section stepped coupling microstrip Schiffman phase shifters with λg/8 length are used to realize wideband phase shift. A three-branch line coupler is employed as wideband bridge. The 8×8 Butler matrix sample working in C band frequency is designed and fabricated, and the measured results indicate that the return loss of each port is better than -10dB in the frequency range over 4.2GHz-5.3GHz, while the isolation is better than 17dB, the distribution error is less than ±1dB, the phase error is less than ±12° and the average measured insert loss is about 2.5dB. Compared with conventional structure using crossover, the novel Butler matrix not only has lower loss and better adaptability to large scale multi-beam forming network, but also has more size reduction.
  • Keywords
    phase shifters; waveguide couplers; C band frequency; compact 8×8 Butler matrix; double-layer substrate structure; frequency 4.2 GHz to 5.3 GHz; multibeam forming network; phase error; three-branch line coupler; two-section stepped coupling microstrip Schiffman phase shifters; wideband bridge; wideband phase shift; Butler matrices; Couplers; Insertion loss; Loss measurement; Microstrip; Phase shifters; Substrates; Butler Matrix; Multi-layer; Schiffman phase shifter; Wide-Band;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE), 2013 IEEE 5th International Symposium on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4673-6077-7
  • Type

    conf

  • DOI
    10.1109/MAPE.2013.6689925
  • Filename
    6689925