• DocumentCode
    658514
  • Title

    Table of contents

  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Abstract
    The following topics are dealt with: 3D IC design for test; power aware testing; at-speed testing; analog-mixed signal test; memory defects; converter testing; 3D IC interposer test; defect-based test; memory testing; automatic test pattern generation; process variations; and yield enhancement and security.
  • Keywords
    automatic test pattern generation; design for testability; integrated circuit testing; integrated circuit yield; integrated memory circuits; mixed analogue-digital integrated circuits; three-dimensional integrated circuits; 3D IC interposer test; 3D integrated circuits; analog-mixed signal test; at-speed testing; automatic test pattern generation; converter testing; defect-based test; design for test; memory defects; memory testing; power aware testing; process variations; security; yield enhancement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Symposium (ATS), 2013 22nd Asian
  • Conference_Location
    Jiaosi Township
  • ISSN
    1081-7735
  • Type

    conf

  • DOI
    10.1109/ATS.2013.4
  • Filename
    6690594