Author :
Wu-Tung Cheng ; Shen, William Wu
Abstract :
These invited talk discuss the following: New Approaches to Improving Quality and Accelerating Yield Ramp to Meet Process Technology Disruptions; 3DIC´s System Design Impact and Testing Needs.
Keywords :
integrated circuit design; integrated circuit testing; three-dimensional integrated circuits; 3DIC; process technology disruptions; quality improvement; system design impact; testing needs; yield ramp;
Conference_Titel :
Test Symposium (ATS), 2013 22nd Asian
Conference_Location :
Jiaosi Township
DOI :
10.1109/ATS.2013.68
