Title :
Cost-Effective TAP-Controlled Serialized Compressed Scan Architecture for 3D Stacked ICs
Author :
Chen-An Chen ; Yee-Wen Chen ; Chun-Lung Hsu ; Ming-Hsueh Wu ; Kun-Lun Luo ; Bing-Chuan Bai ; Liang-Chia Cheng
Author_Institution :
Inf. & Commun. Res. Labs, Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
This paper proposes a cost-effective TAP-controlled serialized compressed scan architecture (SCSA) design to support known-good-die (KGD) test, known-good-stack (KGS) test and post-bond test in the 3D stacked ICs (3D-SICs) configuration. Additionally, a serialized compressed signal generator (SCSG) design is also developed of the proposed scheme to generate the corresponding controlled signals for SCSA to ensure the test cost reduction. Experimental results and comparisons show that the proposed scheme can effectively achieve the good performance in test pin count and test time reduction with little extra hardware overhead penalty.
Keywords :
costing; design for testability; integrated circuit testing; three-dimensional integrated circuits; 3D stacked IC; SCSA; TAP-controlled serialized compressed scan architecture; cost-effective; known-good-die test; post-bond test; test cost reduction; test pin count; test time reduction; Discrete Fourier transforms; Multimedia communication; Pins; Ports (Computers); Stacking; Testing; Three-dimensional displays; 3D-SIC; SCSA; SCSG;
Conference_Titel :
Test Symposium (ATS), 2013 22nd Asian
Conference_Location :
Jiaosi Township
DOI :
10.1109/ATS.2013.29