DocumentCode :
658871
Title :
A cooperative power management with auto-configured multi-phase control and real-time power module swap
Author :
Jen-Huan Tsai ; Shin-Jie Huang ; Po-Hsing Lan ; Po-Chiun Huang
Author_Institution :
Nat. Tsing-Hua Univ., Hsin-Chu, Taiwan
fYear :
2013
fDate :
11-13 Nov. 2013
Firstpage :
53
Lastpage :
56
Abstract :
For high power efficiency and better signal integrity, distributed power modules with sophisticated management control are popular in modern SiP, SoC and 3D-IC designs. To dynamically and extensively utilize the idle and redundant power modules, this work applies a cooperative concept for on-chip power management. Current control is used to balance the load for distributed power modules. An estimator with digital engine executes intelligent actions such as real-time adding/dropping power modules depending on load and thermal conditions. It automatically configures the power system with proper phase interleaving. In the prototype chip using 0.35-μm CMOS, four modules are connected as a cooperative power network to convert 2.7V to 4.3V input to 1.8V output voltage with less than 25mV ripple. PFM achieves 76% efficiency under 20mA load. 88% power efficiency in PWM with four cooperative modules is 8.5% higher than that with single module under 300mA load.
Keywords :
electric current control; integrated circuit design; phase control; power electronics; system-in-package; system-on-chip; three-dimensional integrated circuits; 3D-IC design; SiP design; SoC design; auto-configured multiphase control; cooperative power management; cooperative power network; current control; digital engine; distributed power modules; high power efficiency; load condition; management control; on-chip power management; phase interleaving; power system; real-time adding/dropping power modules; real-time power module swap; signal integrity; size 0.35 mum; thermal condition; voltage 1.8 V; voltage 2.7 V to 4.3 V; Delays; Indexes; Inductors; Multichip modules; Pulse width modulation; Real-time systems; System-on-chip;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-0277-4
Type :
conf
DOI :
10.1109/ASSCC.2013.6690980
Filename :
6690980
Link To Document :
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