• DocumentCode
    658874
  • Title

    A stacked full-bridge topology for high voltage DC-AC conversion in standard CMOS technology

  • Author

    Callemeyn, Piet ; Steyaert, M.

  • Author_Institution
    ESAT-MICAS, KU Leuven, Leuven, Belgium
  • fYear
    2013
  • fDate
    11-13 Nov. 2013
  • Firstpage
    65
  • Lastpage
    68
  • Abstract
    A monolithic DC-AC converter is realized in a 130 nm 1.2V CMOS technology using a Class-D half-bridge topology. Several dies are combined to achieve a full-bridge topology, realizing a bipolar output voltage. Using a stacking technique, this output voltage can be increased. This yields AC output voltages up to 4V, which is more than three times the nominal 1.2V supply voltage of the technology. The passives are integrated on-chip. Consequently, the bill of materials (BOM) is heavily reduced. In a standard half-bridge topology, bulky external capacitors are needed to filter out the DC offset. This main obstacle of an off-chip capacitor is alleviated in the full-bridge topology, reducing the BOM even more. An output peak-to-peak voltage of 3.8V is achieved at a maximal efficiency of 58.3%. A total output power of 56mW is obtained.
  • Keywords
    CMOS integrated circuits; DC-AC power convertors; bridge circuits; class-D half bridge topology; efficiency 58.3 percent; high voltage DC-AC conversion; monolithic DC-AC converter; off chip capacitor; power 56 mW; size 130 nm; stacked full bridge topology; standard CMOS technology; voltage 1.2 V; voltage 3.8 V; voltage 4 V; Bills of materials; CMOS integrated circuits; CMOS technology; Capacitors; Inverters; System-on-chip; Topology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4799-0277-4
  • Type

    conf

  • DOI
    10.1109/ASSCC.2013.6690983
  • Filename
    6690983