DocumentCode
658887
Title
A fully static topologically-compressed 21-transistor flip-flop with 75% power saving
Author
Kawai, N. ; Takayama, S. ; Masumi, Junya ; Kikuchi, Naoya ; Itoh, Yoshio ; Ogawa, Koichi ; Ugawa, Akimitsu ; Suzuki, Hajime ; Tanaka, Yuichi
Author_Institution
Toshiba Microelectron. Corp. Kawasaki City, Kawasaki, Japan
fYear
2013
fDate
11-13 Nov. 2013
Firstpage
117
Lastpage
120
Abstract
An extremely low-power flip-flop named topologically-compressed flip-flop (TCFF) is proposed. As compared with conventional flip-flops, the novel FF reduces power dissipation by 75% at 0% data activity. This power reduction ratio is the highest among FFs that have been reported so far. The reduction is achieved by applying topological compression method, merger of logically equivalent transistors to an unconventional latch structure. The very small number of transistors, only three, connected to clock signal reduces the power drastically, and the smaller total transistor count assures the same cell size as conventional FFs. In addition, fully static full-swing operation makes the cell tolerant of supply voltage and input slew variation. An experimental chip design with 40-nm CMOS shows that almost all conventional FFs are replaceable with proposed FF while preserving the same system performance and layout size.
Keywords
CMOS logic circuits; clocks; flip-flops; logic design; low-power electronics; CMOS; cell size; clock signal; data activity; extremely low-power flip-flop; fully static full-swing operation; fully static topologically-compressed 21-transistor flip-flop; input slew variation; layout size; logically equivalent transistors; power dissipation; power reduction ratio; size 40 nm; supply voltage variation; system performance; topological compression method; transistor count; unconventional latch structure; Clocks; Delays; Flip-flops; Latches; Layout; Power dissipation; Transistors; LSI; flip-flop; low-power;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
Conference_Location
Singapore
Print_ISBN
978-1-4799-0277-4
Type
conf
DOI
10.1109/ASSCC.2013.6690996
Filename
6690996
Link To Document