DocumentCode :
658911
Title :
A 32-Gb/s backplane transceiver with on-chip AC-coupling and low latency CDR in 32-nm SOI CMOS technology
Author :
Gangasani, Gautam R. ; Bulzacchelli, John F. ; Beukema, Troy ; Chun-Ming Hsu ; Kelly, Wayne ; Xu, Hui H. ; Freitas, David ; Prati, Andrea ; Gardellini, Daniele ; Cervelli, Giovanni ; Hertle, Juergen ; Baecher, Matthew ; Garlett, Jon ; Reutemann, Robert ;
Author_Institution :
IBM Syst. & Technol. Group, Hopewell Junction, NY, USA
fYear :
2013
fDate :
11-13 Nov. 2013
Firstpage :
213
Lastpage :
216
Abstract :
This paper describes key design features of a 32-Gb/s 4-tap FFE/15-tap DFE transceiver in 32-nm SOI CMOS which mitigate major sources of degradation in transceiver performance. The transceiver employs a passive feed-forward restore (FFR) scheme in an on-chip AC-coupling network to prevent pattern-dependent baseline wander, a low latency clock and data recovery (CDR) to improve high frequency jitter tolerance, and a token-based power management scheme to reduce supply ripple. The transceiver can equalize a channel with 30dB of loss at a bit-error rate below 10-12 while using 21 mW/Gbps at 1V supply and 0.7 mm2.
Keywords :
CMOS analogue integrated circuits; clock and data recovery circuits; decision feedback equalisers; elemental semiconductors; jitter; silicon-on-insulator; transceivers; DFE transceiver; SOI CMOS technology; Si; backplane transceiver; bit rate 32 Gbit/s; bit-error rate; channel equalization; high-frequency jitter tolerance; loss 30 dB; low-latency CDR; low-latency clock-and-data recovery; on-chip AC-coupling network; passive FFR scheme; passive feed-forward restore scheme; pattern-dependent baseline wander; size 32 nm; supply ripple reduction; token-based power management scheme; transceiver performance; voltage 1 V; CMOS integrated circuits; Clocks; Decision feedback equalizers; Jitter; Receivers; System-on-chip; Transceivers; Low latency digital-CDR; On-chip AC-coupling; Passive feed-forward restore; Serial link; Token-based power management; Transceiver;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference (A-SSCC), 2013 IEEE Asian
Conference_Location :
Singapore
Print_ISBN :
978-1-4799-0277-4
Type :
conf
DOI :
10.1109/ASSCC.2013.6691020
Filename :
6691020
Link To Document :
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