• DocumentCode
    659050
  • Title

    A Vectorless framework for power grid electromigration checking

  • Author

    Fawaz, Mohammad ; Chatterjee, Saptarshi ; Najm, Farid N.

  • Author_Institution
    Dept. of ECE, Univ. of Toronto, Toronto, ON, Canada
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    553
  • Lastpage
    560
  • Abstract
    Electromigration (EM) in the on-die metal lines has re-emerged as a significant concern in modern VLSI circuits. The higher levels of temperature on die and the very large number of metal lines, coupled with the conservatism inherent in traditional EM checking strategies, have led to a situation where trying to guarantee EM reliability often leads to unacceptably conservative designs that may not meet the area or performance specs. Due to unidirectional currents, this problem is most significant in the power and ground grids. Thus, this work is aimed at reducing the pessimism in EM prediction for power/ground grids. There are two sources for the high pessimism: 1) the use of the traditional series model for EM checking and 2) pessimistic assumptions about the chip workload and the corresponding supply currents. To address this problem, we propose a framework for EM checking that allows users to specify conditions-of-use type constraints that help capture realistic chip workload and which includes the use of a novel mesh model for EM prediction in the grid, instead of the traditional series model.
  • Keywords
    VLSI; electromigration; integrated circuit modelling; EM checking strategies; EM reliability; chip workload; ground grids; mesh model; modern VLSI circuits; on-die metal lines; power grid electromigration checking; supply currents; traditional series model; unidirectional currents; vectorless framework; Electromigration; Integrated circuit modeling; Metals; Monte Carlo methods; Power grids; Solid modeling; Vectors; Electromigration; Optimization; Power grid; Redundancy; Verification;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2013.6691170
  • Filename
    6691170