DocumentCode
659072
Title
Post-route alleviation of dense meander segments in high-performance printed circuit boards
Author
Tsun-Ming Tseng ; Bing Li ; Tsung-Yi Ho ; Schlichtmann, Ulf
Author_Institution
Tech. Univ. Muenchen, Munich, Germany
fYear
2013
fDate
18-21 Nov. 2013
Firstpage
713
Lastpage
720
Abstract
Length-matching is an important technique to balance delays of bus signals in high-performance PCB routing. Existing routers, however, may generate dense meander segments with small distance. Signals propagating across these meander segments exhibit a speedup effect due to crosstalks between the segments of the same wire, thus leading to mismatch of arrival times even with the same physical wire length. In this paper, we propose a post-processing method to enlarge the width and the distance of meander segments and distribute them more evenly on the board so that the crosstalks can be reduced. In the proposed framework, we model the sharing combinations of available routing areas after removing dense meander segments from the initial routing, as well as the generation of relaxed meander segments and their groups in subareas. Thereafter, this model is transformed into an ILP problem and solved efficiently. Experimental results show that the proposed method can extend the width and the distance of meander segments about two times even under very tight area constraints, so that the crosstalks and thus the speedup effect can be alleviated effectively in high-performance PCB designs.
Keywords
crosstalk; integer programming; linear programming; network routing; printed circuit design; wires (electric); ILP problem; PCB; bus signal delay; crosstalk; high-performance printed circuit board routing design; integer linear programming; length-matching; physical wire length; post-processing method; post-route alleviation; relaxed dense meander segment generation; signal propagation; Crosstalk; Delays; Mathematical model; Nickel; Routing; Silicon; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
Conference_Location
San Jose, CA
ISSN
1092-3152
Type
conf
DOI
10.1109/ICCAD.2013.6691193
Filename
6691193
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