• DocumentCode
    659072
  • Title

    Post-route alleviation of dense meander segments in high-performance printed circuit boards

  • Author

    Tsun-Ming Tseng ; Bing Li ; Tsung-Yi Ho ; Schlichtmann, Ulf

  • Author_Institution
    Tech. Univ. Muenchen, Munich, Germany
  • fYear
    2013
  • fDate
    18-21 Nov. 2013
  • Firstpage
    713
  • Lastpage
    720
  • Abstract
    Length-matching is an important technique to balance delays of bus signals in high-performance PCB routing. Existing routers, however, may generate dense meander segments with small distance. Signals propagating across these meander segments exhibit a speedup effect due to crosstalks between the segments of the same wire, thus leading to mismatch of arrival times even with the same physical wire length. In this paper, we propose a post-processing method to enlarge the width and the distance of meander segments and distribute them more evenly on the board so that the crosstalks can be reduced. In the proposed framework, we model the sharing combinations of available routing areas after removing dense meander segments from the initial routing, as well as the generation of relaxed meander segments and their groups in subareas. Thereafter, this model is transformed into an ILP problem and solved efficiently. Experimental results show that the proposed method can extend the width and the distance of meander segments about two times even under very tight area constraints, so that the crosstalks and thus the speedup effect can be alleviated effectively in high-performance PCB designs.
  • Keywords
    crosstalk; integer programming; linear programming; network routing; printed circuit design; wires (electric); ILP problem; PCB; bus signal delay; crosstalk; high-performance printed circuit board routing design; integer linear programming; length-matching; physical wire length; post-processing method; post-route alleviation; relaxed dense meander segment generation; signal propagation; Crosstalk; Delays; Mathematical model; Nickel; Routing; Silicon; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer-Aided Design (ICCAD), 2013 IEEE/ACM International Conference on
  • Conference_Location
    San Jose, CA
  • ISSN
    1092-3152
  • Type

    conf

  • DOI
    10.1109/ICCAD.2013.6691193
  • Filename
    6691193