DocumentCode :
661539
Title :
Ultralow on-resistance 30–40 V UMOSFET by 2-D scaling of ion-implanted superjunction structure
Author :
Okubo, Hisanori ; Kobayashi, Kenya ; Kawashima, Yoshiya
Author_Institution :
Power Device Technol. Dept., Renesas Electron. Corp., Kawasaki, Japan
fYear :
2013
fDate :
26-30 May 2013
Firstpage :
87
Lastpage :
90
Abstract :
We present an ultimately narrow pitch superjunction UMOSFET (SJ-UMOS) with a record low specific on-resistance (Rsp) for automotive applications. This high performance device was designed by not only shrinkage of lateral p/n pitch, but reduction of longitudinal dimension for voltage sustaining region including ion-implanted p-columns. The refined technologies brought us a fully depleted SJ structure with extremely scaled pitch to a minimum of 1.0 μm. In the developed SJ-UMOS, an ultralow Rsp (VGS = 10 V) of 4.75 miimm2 (2.95 miimm2 without a substrate component) at a breakdown voltage of 32.8 V was obtained. We also confirmed excellent properties of low RonQG FOM and soft recovery operation of a body diode due to the best architecture around the gate electrode of the MOSFET.
Keywords :
MOSFET; electric breakdown; electrodes; ion implantation; junction gate field effect transistors; shrinkage; 2D scaling; FOM; SJ-UMOS; automotive application; body diode soft recovery operation; breakdown voltage; fully depleted SJ structure; gate electrode; ion-implanted p-column; ion-implanted superjunction structure; lateral p-n pitch shrinkage; longitudinal dimension reduction; size 1.0 mum; ultimately narrow pitch superjunction UMOSFET; ultralow on-resistance UMOSFET; voltage 10 V; voltage 30 V to 40 V; voltage 32.8 V; voltage sustaining region; Automotive applications; Current measurement; Impurities; Light emitting diodes; Logic gates; MOSFET; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
Conference_Location :
Kanazawa
ISSN :
1943-653X
Print_ISBN :
978-1-4673-5134-8
Type :
conf
DOI :
10.1109/ISPSD.2013.6694403
Filename :
6694403
Link To Document :
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