DocumentCode
661548
Title
Suppressing channel-conduction during dynamic avalanche to improve high density power MOSFET ruggedness and reverse recovery softness
Author
Jingjing Chen ; Radic, Ljubo ; Henson, Timothy
Author_Institution
Int. Rectifier, El Segundo, CA, USA
fYear
2013
fDate
26-30 May 2013
Firstpage
321
Lastpage
324
Abstract
This paper demonstrates a new phenomenon for the state-of-the-art ultra-high density trench power MOSFET: channel conduction during dynamic avalanche even when gate voltage is well below the nominal threshold voltage. In particular, a comprehensive study has been done through mixed-mode 2D device simulation and measurement, showing that the channel conduction during avalanche can not only strongly influence body diode reverse recovery behavior, but also impact device ruggedness during Unclamped Inductive Switching (UIS). Results show that by suppressing the channel conduction, diode reverse recovery softness can be improved by 23% for the same reverse peak current, and the UIS avalanche current can be improved by 7%, which is significant for the harsh automotive DC-DC converter and hybrid vehicle motor inverter applications.
Keywords
avalanche breakdown; power MOSFET; recovery; channel conduction; dynamic avalanche; gate voltage; harsh automotive DC-DC converter applications; high density power MOSFET ruggedness; hybrid vehicle motor inverter applications; mixed-mode 2D device simulation; reverse recovery softness; unclamped inductive switching; Current density; Electric potential; Impact ionization; Junctions; Logic gates; MOSFET; Threshold voltage; body diode reverse recovery; channel conduction; dynamic avalanche; high current density; trench Power MOSFET;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
Conference_Location
Kanazawa
ISSN
1943-653X
Print_ISBN
978-1-4673-5134-8
Type
conf
DOI
10.1109/ISPSD.2013.6694413
Filename
6694413
Link To Document