• DocumentCode
    661548
  • Title

    Suppressing channel-conduction during dynamic avalanche to improve high density power MOSFET ruggedness and reverse recovery softness

  • Author

    Jingjing Chen ; Radic, Ljubo ; Henson, Timothy

  • Author_Institution
    Int. Rectifier, El Segundo, CA, USA
  • fYear
    2013
  • fDate
    26-30 May 2013
  • Firstpage
    321
  • Lastpage
    324
  • Abstract
    This paper demonstrates a new phenomenon for the state-of-the-art ultra-high density trench power MOSFET: channel conduction during dynamic avalanche even when gate voltage is well below the nominal threshold voltage. In particular, a comprehensive study has been done through mixed-mode 2D device simulation and measurement, showing that the channel conduction during avalanche can not only strongly influence body diode reverse recovery behavior, but also impact device ruggedness during Unclamped Inductive Switching (UIS). Results show that by suppressing the channel conduction, diode reverse recovery softness can be improved by 23% for the same reverse peak current, and the UIS avalanche current can be improved by 7%, which is significant for the harsh automotive DC-DC converter and hybrid vehicle motor inverter applications.
  • Keywords
    avalanche breakdown; power MOSFET; recovery; channel conduction; dynamic avalanche; gate voltage; harsh automotive DC-DC converter applications; high density power MOSFET ruggedness; hybrid vehicle motor inverter applications; mixed-mode 2D device simulation; reverse recovery softness; unclamped inductive switching; Current density; Electric potential; Impact ionization; Junctions; Logic gates; MOSFET; Threshold voltage; body diode reverse recovery; channel conduction; dynamic avalanche; high current density; trench Power MOSFET;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Semiconductor Devices and ICs (ISPSD), 2013 25th International Symposium on
  • Conference_Location
    Kanazawa
  • ISSN
    1943-653X
  • Print_ISBN
    978-1-4673-5134-8
  • Type

    conf

  • DOI
    10.1109/ISPSD.2013.6694413
  • Filename
    6694413